(footprint "SOIC-8-1EP_3.9x4.9mm_Pitch1.27mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 59C023A3)
  (descr "8-Lead Thermally Enhanced Plastic Small Outline (SE) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "SOIC 1.27")
  (attr smd)
  (fp_text reference "REF**" (at 0 -3.5) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 0ebe4d37-6529-4a12-83a1-70a76602dc5b)
  )
  (fp_text value "SOIC-8-1EP_3.9x4.9mm_Pitch1.27mm" (at 0 3.5) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp b3037504-e5ed-4a7b-9369-d20a33cf083c)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 0.9 0.9) (thickness 0.135)))
    (tstamp 7fcbbbd7-78bc-4c1d-8ba0-9c52115d8160)
  )
  (fp_line (start -2.075 2.575) (end -2.075 2.43) (layer "F.SilkS") (width 0.15) (tstamp 0671cf6c-de5c-47c2-be8b-35ee7cc804d9))
  (fp_line (start 2.075 -2.575) (end 2.075 -2.43) (layer "F.SilkS") (width 0.15) (tstamp 2869e634-2698-4ebc-bded-3715e23afc65))
  (fp_line (start -2.075 -2.575) (end 2.075 -2.575) (layer "F.SilkS") (width 0.15) (tstamp 46944ca0-f787-486f-b840-4806541a0477))
  (fp_line (start 2.075 2.575) (end 2.075 2.43) (layer "F.SilkS") (width 0.15) (tstamp b42e5f73-97e4-4980-a58e-3c3ebb5a384b))
  (fp_line (start -2.075 -2.525) (end -3.475 -2.525) (layer "F.SilkS") (width 0.15) (tstamp b7e70d28-2b14-4046-8410-05d536867d2f))
  (fp_line (start -2.075 -2.575) (end -2.075 -2.525) (layer "F.SilkS") (width 0.15) (tstamp cbffb18f-19b4-4bb0-aa85-a4abacb4719f))
  (fp_line (start -2.075 2.575) (end 2.075 2.575) (layer "F.SilkS") (width 0.15) (tstamp fac06250-b5c5-41a7-8461-8f55c9351d57))
  (fp_line (start -3.75 -2.75) (end -3.75 2.75) (layer "F.CrtYd") (width 0.05) (tstamp 6a7aa359-4abf-4ffa-ad4e-e2cd429794af))
  (fp_line (start 3.75 -2.75) (end 3.75 2.75) (layer "F.CrtYd") (width 0.05) (tstamp 8e1bb91f-f1c4-430d-a1f0-61b2f9711e95))
  (fp_line (start -3.75 -2.75) (end 3.75 -2.75) (layer "F.CrtYd") (width 0.05) (tstamp c9a08d9e-7d84-438b-8ff1-7c96bef56fc6))
  (fp_line (start -3.75 2.75) (end 3.75 2.75) (layer "F.CrtYd") (width 0.05) (tstamp ebb0a9d7-6a71-41ef-975f-4da3b2c15877))
  (fp_line (start -1.95 -1.45) (end -0.95 -2.45) (layer "F.Fab") (width 0.15) (tstamp 0ec7fee7-7e6e-49fa-bcdc-51509bca8916))
  (fp_line (start 1.95 -2.45) (end 1.95 2.45) (layer "F.Fab") (width 0.15) (tstamp 2c5cd7f6-d800-485c-913c-105c80584d2f))
  (fp_line (start -1.95 2.45) (end -1.95 -1.45) (layer "F.Fab") (width 0.15) (tstamp 6885f1cc-1252-414f-8934-8f99d9a410fc))
  (fp_line (start 1.95 2.45) (end -1.95 2.45) (layer "F.Fab") (width 0.15) (tstamp 6c0c83fe-0bec-4891-a716-fe76cccf7889))
  (fp_line (start -0.95 -2.45) (end 1.95 -2.45) (layer "F.Fab") (width 0.15) (tstamp ed608c3c-c5f1-44de-9c4d-294610f75b75))
  (pad "1" smd rect (at -2.7 -1.905) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp e28f7cf4-a2dc-494f-bb33-71e6188848f0))
  (pad "2" smd rect (at -2.7 -0.635) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp dcfa51e8-bb40-41f8-994b-7816f71fb248))
  (pad "3" smd rect (at -2.7 0.635) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp ca18b4e4-2fc1-4059-a9ea-2b75c395a4c9))
  (pad "4" smd rect (at -2.7 1.905) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp a2982139-2525-4187-a09d-b1680627a2bc))
  (pad "5" smd rect (at 2.7 1.905) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8e07f4d9-a24e-4919-b0cc-9c55cab4b99f))
  (pad "6" smd rect (at 2.7 0.635) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp b324bb36-5de3-42d5-b7bd-284f17d0a17a))
  (pad "7" smd rect (at 2.7 -0.635) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 8644661d-7dc3-45f8-ac28-568e08a8febf))
  (pad "8" smd rect (at 2.7 -1.905) (size 1.55 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp d03b2957-18fb-4746-bafd-27ee5cd31ce3))
  (pad "9" thru_hole rect (at -0.5875 -1.175) (size 1.175 1.175) (drill 0.6) (layers *.Cu "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 14b190ae-3a54-4832-994d-5b63b94eca54))
  (pad "9" thru_hole rect (at -0.5875 1.175) (size 1.175 1.175) (drill 0.6) (layers *.Cu "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 3c96f4f1-7433-4276-bb5b-c1cec0dbdf75))
  (pad "9" thru_hole rect (at 0.5875 -1.175) (size 1.175 1.175) (drill 0.6) (layers *.Cu "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 608e65f2-b7e3-4479-9396-b95ff2c6de97))
  (pad "9" thru_hole rect (at 0.5875 0) (size 1.175 1.175) (drill 0.6) (layers *.Cu "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 6998f0e5-9793-4a3a-a242-a737375bd07c))
  (pad "9" thru_hole rect (at 0.5875 1.175) (size 1.175 1.175) (drill 0.6) (layers *.Cu "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp 9335d53b-18b3-41b6-8c1a-f75993c3ec01))
  (pad "9" thru_hole rect (at -0.5875 0) (size 1.175 1.175) (drill 0.6) (layers *.Cu "F.Mask")
    (solder_paste_margin_ratio -0.2) (tstamp d333c8b8-487b-4c9e-ac2b-38d8a3fb42c2))
  (model "${KICAD6_3DMODEL_DIR}/Package_SO.3dshapes/SOIC-8_3.9x4.9mm_P1.27mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)